Is your PCB assembly living up to its promise? Are you confident in the quality of every layer, via, and connection? These questions keep many electronics manufacturers up at night.

PCB microsection analysis offers a way to peek beneath the surface. This robust testing method can reveal hidden flaws and confirm manufacturing quality. But is it truly necessary for your assembly?

The answer depends on various factors. What level of reliability does your product demand? Are you dealing with high-density boards or pushing the limits of your fabrication process? Let’s explore microsection analysis and find out when it becomes a critical quality assurance tool.

PCB Microsection Analysis Required for Your Assembly

(wirestock/Freepik)

Understanding Microsection Analysis

Microsection analysis is a diagnostic technique that reveals the internal structure of printed circuit boards. Manufacturers primarily use it to evaluate the quality and integrity of PCB production.

For example, a batch of PCBs may have manufacturing defects that are undetectable through surface inspection alone, such as insufficient plating in through-holes or internal layer misalignment.

With microsection analysis, you can detect these hidden flaws and verify that your boards meet precise specifications. You can also measure critical dimensions like copper thickness and dielectric spacing to ensure compliance with industry standards.

The Microsection Analysis Process

Microsection analysis involves several key steps to prepare and examine a PCB sample. A skilled technician takes a small section of your PCB and processes it to reveal its internal structure. Here are the steps:

  • The technician selects a representative sample from the PCB batch
  • They cut out a small coupon from the chosen board
  • The technician embeds the coupon in a resin block for stability
  • They grind and polish one face of the block to expose a clear cross-section
  • The analyst examines the prepared sample under high-powered microscopes
  • They analyze and document findings, including measurements and potential defects

Each stage requires precision to ensure accurate results that reflect the PCB’s true quality.

Examining Key Features Through Microsection Analysis

Microsection analysis reveals important details about your PCB’s inner structure. Quality control technicians examine several key aspects to ensure the board’s quality and performance. Here’s what they look for:

Plated Through-Hole Quality

The technician measures the copper thickness inside the holes. They look for even plating that sticks well to the board. If the plating is too thin, uneven, or has defects, it can cause connections to fail and make the board less reliable. Microsection analysis helps reveal any gaps or cracks in the plating that might not be visible from the surface.

Layer Alignment

They evaluate how precisely PCB layers line up. Misaligned layers lead to connection issues or short circuits. Technicians compare alignment measurements against design specs to ensure everything matches properly.

Solder Mask

Technicians measure solder mask thickness and verify that it covers the correct areas. A well-applied solder mask protects copper traces from oxidation and unwanted connections. They confirm the mask adheres firmly to both the board and copper.

Copper Thickness

Technicians measure the copper trace thickness on each PCB layer and compare it to design specifications. If the copper is too thick or too thin, they flag it for further investigation. The technician then examines the cause of the discrepancy and evaluates its impact on the PCB’s overall performance.

Other Hidden Issues

Technicians thoroughly inspect the PCB to identify hidden issues within the layers. This includes detecting areas where layers may be separating or gaps where none should exist. They also check for improperly mixed materials or foreign particles that could compromise the board. Finding these problems early helps prevent PCB failures and ensures better product reliability.

Should You Consider Microsection Analysis for Your PCB?

So, is microsection analysis necessary for your project? Ask yourself a few key questions to find out.

Does your product serve a critical function in high-reliability industries?

Yes ➡ You’ll need microsection analysis to ensure maximum reliability.

No ➡ You might still benefit from it, but it’s not essential.

Are you working with complex multilayer or high-density PCBs?

Yes ➡ Consider using microsection analysis to catch hidden issues.

No ➡ Other testing methods should cover your needs.

Do you expect your boards to face extreme conditions like high temperatures or heavy vibrations?

Yes ➡ Microsection analysis will confirm your board’s durability over time.

No ➡ A simpler test could be enough to validate performance.

Are you pushing the boundaries with new materials or techniques?

Yes ➡ Use microsection analysis to identify potential risks early.

No ➡ Routine tests should be sufficient to ensure quality.

Combining Microsection Analysis with Other Testing Methods

While microsection analysis is a powerful tool, it’s not the only method available for ensuring PCB quality. Combining it with other tests can provide a more comprehensive understanding of your assembly’s performance.

Different tests serve different purposes, and the best strategy depends on your specific needs. A well-rounded testing plan can minimize the risk of defects and improve the overall reliability of your PCB.

Here’s a look at common testing methods that complement microsection analysis:

Testing Method Purpose Benefit
Microsection Analysis Reveals internal structure of
PCBs
Identifies internal defects,
layer alignment, and plating
issues
X-ray Inspection Non-destructive view of inner
layers
Detects voids, misalignment,
and component placement
Solderability Testing Evaluates solder adhesion Ensures proper bonding of
solder to pads and
components
Peel Testing Measures bond strength of
PCB laminate
Confirms durability and
resistance to delamination
Burn-In Testing Stress tests boards to
simulate extended use
Uncovers issues that develop
over time under operating
conditions
Flying Probe Testing Tests electrical performance Checks for shorts, opens,
and correct component
values
Automated Optical
Inspection (AOI)
Scans boards using 3D
cameras
Detects surface-level defects
like missing or misaligned
components

Final Verdict

That’s everything you need to know about microsection analysis. Hopefully, you now have a clearer picture of whether it’s the right fit for your project.

To recap, microsection analysis is ideal for high-reliability applications and complex PCB designs. If your boards need the highest standards of quality and durability, consider adding it to your testing process.

If you’re still unsure, consider getting a second opinion from an electronic manufacturing services provider. They can analyze your assembly and help you make the best decision for your business.